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1

Bending stress analysis of flexible touch panel

Yeh, Meng-Kao, Chang, Li-Yu, Lu, Min-Ru, Cheng, Hsien-Chie, Wang, Pi-Hsien

Journal:

Microsystem Technologies

Year:

2014

Language:

english

File:

PDF, 1.46 MB

english, 2014

2

On enhancing eutectic solder joint reliability using a second-reflow-process approach

Kuo-Ning Chiang,, Yung-Te Lin,, Hsien-Chie Cheng,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2000

Language:

english

File:

PDF, 398 KB

english, 2000

3

On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules

Chen, Wen-Hwa, Cheng, Hsien-Chie, Lin, Chih-Han

Journal:

Journal of Electronic Packaging

Year:

2004

Language:

english

File:

PDF, 806 KB

english, 2004

4

Heat dissipation assessment of through silicon via (TSV)-based 3D IC packaging for CMOS image sensing

Cheng, Hsien-Chie, Huang, Tzu-Chin, Hwang, Po-Wen, Chen, Wen-Hwa

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 1.92 MB

english, 2016

5

Topological design for vibrating structures

Zheng-Dong Ma, Noboru Kikuchi, Hsien-Chie Cheng

Journal:

Computer Methods in Applied Mechanics and Engineering

Year:

1995

Language:

english

File:

PDF, 1.63 MB

english, 1995

6

Development of three-dimensional chip stacking technology using a clamped through-silicon via interconnection

Li-Cheng Shen, Chien-Wei Chien, Hsien-Chie Cheng, Chia-Te Lin

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 2.89 MB

english, 2010

7

Thermal–mechanical optimization of a novel nanocomposite-film typed flip chip technology

Hsien-Chie Cheng, Kun-Yu Hsieh, Kuo-Ming Chen

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 856 KB

english, 2011

8

Thermal Chip Placement in MCMs Using a Novel Hybrid Optimization Algorithm

Hsien-Chie Cheng, I-Chun Chung, Wen-Hwa Chen

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2012

Language:

english

File:

PDF, 773 KB

english, 2012

9

Crystal size and direction dependence of the elastic properties of Cu3Sn through molecular dynamics simulation and nanoindentation testing

Wen-Hwa Chen, Ching-Feng Yu, Hsien-Chie Cheng, Su-Tsai Lu

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.66 MB

english, 2012

10

Thermal-Mechanical Process Simulation of an Advanced NCF Technology

Hsien-Chie Cheng, Wan-Yu Hwang, Kuo Shu Kao, Tsang, J., Yang, S.S., Chao-Chyun An, Chang, S.M.

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2009

Language:

english

File:

PDF, 1.34 MB

english, 2009

11

IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging

Chen, Wen-Hwa, Yu, Ching-Feng, Cheng, Hsien-Chie, Tsai, Yu-min, Lu, Su-Tsai

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.69 MB

english, 2013

12

Mechanical property effects of Si1−xGex channel and stressed contact etching stop layer on nano-scaled n-type metal–oxide–semiconductor field effect transistors

Lee, Chang-Chun, Cheng, Hsien-Chie, Hsu, Hung-Wen, Chen, Zih-Han, Teng, Hsiao-Hsuan, Liu, Chuan-Hsi

Journal:

Thin Solid Films

Year:

2014

Language:

english

File:

PDF, 1.62 MB

english, 2014

13

[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - CFD-based thermal characterization of board-level microelectronic devices under natural convection cooling

Po-Wen Hwang,, Hsien-Chie Cheng,, Jiunn Fang,, Jia-Han Li,

Year:

2007

Language:

english

File:

PDF, 829 KB

english, 2007

14

Response Surface Based Optimization Approach for Thermal Placement Design of Chips in Multiple-Chip Modules

Hsien-Chie Cheng,, I-Chun Chung,, Wen-Hwa Chen,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2009

Language:

english

File:

PDF, 887 KB

english, 2009

15

[IEEE 2006 International Microsystems, Package, Assembly Conference Taiwan - Grand Formosa Regent, Taipei, Taiwan (2006.10.18-2006.10.20)] 2006 International Microsystems, Package, Assembly Conference Taiwan - Process-dependent Thermal-mechanical Analysis and Design of a Novel Nanowire-based Anisotropic Conductive Film Assembly

Cheng, Hsien-chie, Lin, Chieh-sheng, Chen, Wen-hwa, Hsu, Yung-yue, Uang, Ruoh-huey

Year:

2006

Language:

english

File:

PDF, 4.10 MB

english, 2006

16

Design and analysis of wafer-level CSP with a double-pad structure

Ji-Cheng Lin,, Hsien-Chie Cheng,, Kuo-Ning Chiang,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2005

Language:

english

File:

PDF, 1.95 MB

english, 2005

17

On the Thermal–Mechanical Behaviors of a Novel Nanowire-Based Anisotropic Conductive Film Technology

Hsien-Chie Cheng,, Wen-Hwa Chen,, Chieh-Sheng Lin,, Yung-Yu Hsu,, Ruoh-Huey Uang,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2009

Language:

english

File:

PDF, 3.92 MB

english, 2009

18

A Force-Directed-Based Optimization Scheme for Thermal Placement Design of MCMs

Cheng, Hsien-Chie, Huang, Yu-Che, Chen, Wen-Hwa

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.39 MB

english, 2007

19

Effects of Bonding Parameters on the Reliability of Fine-Pitch Cu/Ni/SnAg Micro-Bump Chip-to-Chip Interconnection for Three-Dimensional Chip Stacking

Lu, Su-Tsai, Juang, Jing-Ye, Cheng, Hsien-Chie, Tsai, Yu-Ming, Chen, Tai-Hong, Chen, Wen-Hwa

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2012

Language:

english

File:

PDF, 1.20 MB

english, 2012

20

Dual-Frequency Liquid-Crystal Lenses Based on a Surface-Relief Dielectric Structure on an Electrode

Lin, Chi-Huang, Chen, Cheng-Hsiung, Chiang, Ru-Hsien, Jiang, I.-Min, Kuo, Chie-Tong, Huang, Chi-Yen

Journal:

IEEE Photonics Technology Letters

Year:

2011

Language:

english

File:

PDF, 527 KB

english, 2011

21

Interconnect Reliability Characterization of a High-Density 3-D Chip-on-Chip Interconnect Technology

Cheng, Hsien-Chie, Tsai, Yu-Min, Lu, Su-Tsai, Chen, Wen-Hwa

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 2.03 MB

english, 2013

22

Drop Impact Reliability Analysis of 3-D Chip-on-Chip Packaging: Numerical Modeling and Experimental Validation

Hsien-Chie Cheng,, Hsin-Kai Cheng,, Su-Tsai Lu,, Jing-Ye Juang,, Wen-Hwa Chen,

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 1.17 MB

english, 2014

23

An effective methodology for thermal characterization of electronic packaging

Wen-Hwa Chen,, Hsien-Chie Cheng,, Hsin-An Shen,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 851 KB

english, 2003

24

Hygro-thermo-mechanical Behavior of Adhesive-Based Flexible Chip-on-Flex Packaging

Cheng, Hsien-Chie, Huang, Ho-Hsiang, Chen, Wen-Hwa, Lu, Su-Tsai

Journal:

Journal of Electronic Materials

Year:

2015

Language:

english

File:

PDF, 1.75 MB

english, 2015

25

Macroscopic Mechanical Constitutive Characterization of Through-Silicon-via-Based 3-D Integration

Cheng, Hsien-Chie, Li, Ruei-Shiang, Lin, Sheng-Chuen, Chen, Wen-Hwa, Chiang, Kuo-Ning

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2016

Language:

english

File:

PDF, 2.59 MB

english, 2016

26

Mechanical property assessment of black phosphorene nanotube using molecular dynamics simulation

Chen, Wen-Hwa, Yu, Ching-Feng, Chen, I-Chu, Cheng, Hsien-Chie

Journal:

Computational Materials Science

Year:

2017

Language:

english

File:

PDF, 3.73 MB

english, 2017

27

Assessing Ink Transfer Performance of Gravure-Offset Fine-Line Circuitry Printing

Cheng, Hsien-Chie, Chen, You-Wei, Chen, Wen-Hwa, Lu, Su-Tsai, Lin, Shih-Ming

Journal:

Journal of Electronic Materials

Year:

2017

Language:

english

File:

PDF, 2.18 MB

english, 2017

28

Role of Plastic Behaviors of Ni 3 Sn 4 Intermetallic Compound on Solder Joint Reliability

Cheng, Hsien-Chie, Hong, Ruei-You, Hu, Hsuan-Chi, Chen, Wen-Hwa

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2018

Language:

english

File:

PDF, 1.81 MB

english, 2018

29

Bending Characteristics of Foldable Touch Display Panel with a Protection Structure Design

Cheng, Hsien-Chie, Xu, Wei-Heng, Chen, Wen-Hwa, Wang, Pi-Hsien, Chen, Kuo-Feng, Chang, Chih-Chia

Journal:

Advances in Materials Science and Engineering

Year:

2015

Language:

english

File:

PDF, 4.16 MB

english, 2015

30

[IEEE 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Mie, Japan (2018.4.17-2018.4.21)] 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Modeling of cure kinetics of molding compound and its effects on drag force in compression molding

Chung, Chia-Heng, Cheng, Hsien-Chie, Chen, Wen-Hwa

Year:

2018

Language:

english

File:

PDF, 312 KB

english, 2018

31

Improved local control by surgery and paclitaxel-based chemoradiation for esophageal squamous cell carcinoma: Results of a retrospective non-randomized study

Feng-Ming Hsu, Chia-Chi Lin, Jang-Ming Lee, Yih-Leong Chang, Chih-Hung Hsu, Yu-Chieh Tsai, Yung-Chie Lee, Jason Chia-Hsien Cheng

Journal:

Journal of Surgical Oncology

Year:

2008

Language:

english

File:

PDF, 153 KB

english, 2008

32

Molecular dynamics study of interfacial bonding strength of self-assembled monolayer-coated Au-epoxy and Au–Au systems

Hsien-Chie Cheng, Yu-Chen Hsu, Chun-Hung Wu, Wen-Hwa Chen

Journal:

Applied Surface Science

Year:

2011

Language:

english

File:

PDF, 1.15 MB

english, 2011

33

Structural design for obtaining desired eigenfrequencies by using the topology and shape optimization method

Zheng-Dong Ma, Hsien-Chie Cheng, Noboru Kikuchi

Journal:

Computing Systems in Engineering

Year:

1994

Language:

english

File:

PDF, 838 KB

english, 1994

34

Theoretical and experimental characterization of heat dissipation in a board-level microelectronic component

Hsien-Chie Cheng, Wen-Hwa Chen, Hwa-Fa Cheng

Journal:

Applied Thermal Engineering

Year:

2008

Language:

english

File:

PDF, 1.63 MB

english, 2008

35

Thermal placement optimization of multichip modules using a sequential metamodeling-based optimization approach

Hsien-Chie Cheng, Yang-Howa Tsai, Kun-Nan Chen, Jiunn Fang

Journal:

Applied Thermal Engineering

Year:

2010

Language:

english

File:

PDF, 1.40 MB

english, 2010

36

On radial breathing vibration of carbon nanotubes

Hsien-Chie Cheng, Yang-Lun Liu, Chun-Hung Wu, Wen-Hwa Chen

Journal:

Computer Methods in Applied Mechanics and Engineering

Year:

2010

Language:

english

File:

PDF, 624 KB

english, 2010

37

Mechanical material characterization of Co nanowires and their nanocomposite

Wen-Hwa Chen, Hsien-Chie Cheng, Yu-Chen Hsu, Ruoh-Huey Uang, Jiong-Shiun Hsu

Journal:

Composites Science and Technology

Year:

2008

Language:

english

File:

PDF, 646 KB

english, 2008

38

Atomistic-continuum modeling for mechanical properties of single-walled carbon nanotubes

Hsien-Chie Cheng, Yang-Lun Liu, Yu-Chen Hsu, Wen-Hwa Chen

Journal:

International Journal of Solids and Structures

Year:

2009

Language:

english

File:

PDF, 666 KB

english, 2009

39

Modified Nosé–Hoover thermostat for solid state for constant temperature molecular dynamics simulation

Wen-Hwa Chen, Chun-Hung Wu, Hsien-Chie Cheng

Journal:

Journal of Computational Physics

Year:

2011

Language:

english

File:

PDF, 549 KB

english, 2011

40

Strain- and strain-rate-dependent mechanical properties and behaviors of Cu3Sn compound using molecular dynamics simulation

Hsien-Chie Cheng, Ching-Feng Yu, Wen-Hwa Chen

Journal:

Journal of Materials Science

Year:

2012

Language:

english

File:

PDF, 970 KB

english, 2012

41

A web-based distributed problem-solving environment for engineering applications

Hsien-Chie Cheng, Chiu-Shia Fen

Journal:

Advances in Engineering Software (Thomson Reuters)

Year:

2006

Language:

english

File:

PDF, 1.27 MB

english, 2006

42

Association of Clinical and Dosimetric Factors with Postoperative Pulmonary Complications in Esophageal Cancer Patients Receiving Intensity-Modulated Radiation Therapy and Concurrent Chemotherapy Followed by Thoracic Esophagectomy

Feng-Ming Hsu, Yung-Chie Lee, Jang-Ming Lee, Chih-Hung Hsu, Chia-Chi Lin, Yu-Chieh Tsai, Jian-Kuen Wu, Jason Chia-Hsien Cheng

Journal:

Annals of Surgical Oncology

Year:

2009

Language:

english

File:

PDF, 304 KB

english, 2009

43

On the thermal characterization of an RGB LED-based white light module

Hsien-Chie Cheng, Jia-Yun Lin, Wen-Hwa Chen

Journal:

Applied Thermal Engineering

Year:

2012

Language:

english

File:

PDF, 917 KB

english, 2012

44

Radial mechanical properties of single-walled carbon nanotubes using modified molecular structure mechanics

Wen-Hwa Chen, Hsien-Chie Cheng, Yang-Lun Liu

Journal:

Computational Materials Science

Year:

2010

Language:

english

File:

PDF, 686 KB

english, 2010

45

A theoretical investigation of thermal effects on vibrational behaviors of single-walled carbon nanotubes

Wen-Hwa Chen, Chun-Hung Wu, Yang-Lun Liu, Hsien-Chie Cheng

Journal:

Computational Materials Science

Year:

2012

Language:

english

File:

PDF, 552 KB

english, 2012

46

Unenhanced CT in the Diagnosis of Small Bowel Intussusception

Ying-Hsien Huang, Li-Tung Huang, Chao-Cheng Huang, Sheung-Fat Ko, Chie-Song Hsieh, Mao-Meng Tiao

Journal:

The Journal of Emergency Medicine

Year:

2008

Language:

english

File:

PDF, 200 KB

english, 2008

47

Upstream stimulatory factor 2 is implicated in the progression of biliary atresia by regulation of hepcidin expression

Ying-Hsien Huang, Chao-Cheng Huang, Jiin-Haur Chuang, Chie-Sung Hsieh, Shin-Ye Lee, Chao-Long Chen

Journal:

Journal of Pediatric Surgery

Year:

2008

Language:

english

File:

PDF, 355 KB

english, 2008

48

Retrospective Analysis of Outcome Differences in Preoperative Concurrent Chemoradiation With or Without Elective Nodal Irradiation for Esophageal Squamous Cell Carcinoma

Feng-Ming Hsu, Jang-Ming Lee, Pei-Ming Huang, Chia-Chi Lin, Chih-Hung Hsu, Yu-Chieh Tsai, Yung-Chie Lee, Jason Chia-Hsien Cheng

Journal:

International Journal of Radiation Oncology*Biology*Physics

Year:

2011

Language:

english

File:

PDF, 276 KB

english, 2011

49

First-principles density functional calculation of mechanical, thermodynamic and electronic properties of CuIn and Cu2In crystals

Hsien-Chie Cheng, Ching-Feng Yu, Wen-Hwa Chen

Journal:

Journal of Alloys and Compounds

Year:

2013

Language:

english

File:

PDF, 1.97 MB

english, 2013

50

Mini-Catheter Used for Bladder Drainage Following Stress-Incontinence Surgery and the Factors Relating to Drainage Failure

Dr. Tsung-Hsien Su, Jenn-Ming Yang, Chie-Pein Chen, Hsiao-Jui Wei, Yuh-Ming Hwu, Yuh-Cheng Yang

Journal:

Journal of Obstetrics and Gynaecology Research

Year:

1995

Language:

english

File:

PDF, 533 KB

english, 1995